C877 | 3U VPX SBC

Intel ® Xeon® D Processor

The C877 is designed with a modern, high-bandwidth bus architecture and a versatile assortment of on-board I/O interfaces, with an XMC site for additional I/O options. The board is available in both air-cooled and conduction-cooled versions. Several Intel Xeon D and Pentium CPU options are available to provide the balance of CPU throughput and board power consumption that are best for your system.
  • Rugged 3U VPX Single-Slot SBC
  • Intel® Xeon® D CPU Options
  • Xeon D-1577 – 16 cores/32 threads, @ 1.3 GHz/2.1 GHz Turbo Boost
  • Xeon D-1559 – 12 cores/24 threads, @ 1.5 GHz/2.1 GHz Turbo Boost
  • Pentium D-1519 – 4 cores/8 threads, @ 1.5 GHz/2.1 GHz Turbo Boost
  • Up to 32 GB DDR4 w/ECC @ 2133 MT/s
  • Up to 256 GB On-Board SATA SSD
  • Versatile Board I/O
  • USB 3.0 & 2.0
  • Serial
  • 10GbE
  • SATA III
  • Discrete
  • GbE
  • XMC Slot w/PCIe x8 Gen3
  • Xilinx UltraScale+ FPGA w/ARM CPU
  • Custom I/O and Security Features
  • PCIe x8 Gen3 Link to Xeon CPU
  • 8 Lanes PCIe Gen3 VPX Data Plane
  • Intel Security (TPM 2.0, TXT, Secure Boot)
  • WWDT, IPMI, ETR, RTC, Temp. Sensors
  • Windows®, Linux®, VxWorks® Support
  • OpenVPX Compliant
  • 2LM Option per VITA 48.2
  • Conduction and Air-Cooled Versions
  • Vibration and Shock Resistant

C877 Block Diagram

TM877

Rear Transition Module (RTM) providing convenient access to C877 I/O interfaces via standard connectors and to all XMC I/O via headers. Supports both air and conduction-cooled C877 when installed in a compatible system.

Learn more about the TM877 transition module >>

CM870

3U VPX PMC/XMC carrier board. Using one or more CM870s, system functionality can be significantly expanded, enabling the C877 to control additional PMCs/XMCs over the VPX backplane.

Learn more about the CM870 carrier card >>

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