A172 | SFF HPEC

The A172 is a low profile, rugged high performance embedded computer (HPEC) that provides exceptional design flexibility in a low power, high performance computing system. Developed around a standard Type 6 Com Express module, the A172 features an industry standard pinout and the ability to support multiple processor options for easy system integration as well as cost-effective technology insertion upgrades.

Weighing under 5 lbs (2.25 kg) with dimensions of only 10.24 x 7.09 x 1.8” (260 x 180 x 46 mm), the A172 maximizes SWaP-C for applications with limited space requirements.

It also features a flexible architecture for upgrading the CPU to the next generation, as well as expansion options such as mini-PCIe cards and up to 1 TB of removable storage. The A172  includes multiple I/O interfaces that make the rugged, Intel Core I7-based unit ideal for high impact, high performance military applications. These include manned and unmanned fixed- and rotary-wing airborne (UAV) platforms.