U-C8770 | High-Performance Secure 3U SBC
More than a computer, the Intel® Xeon-based U-C8770 SBC features Aitech’s proprietary AiSecure™ architecture coupled with an on-board Xilinx® UltraScale+ FPGA and 64GB RAM. Aligned with The Open Group Sensor Open Systems Architecture™ (SOSA) the SBC is perfect for systems that need to combine high performance with advanced protection against cyber-attacks and IP theft for higher survivability and safer export.
An adaptation of Aitech’s high performance, rugged C877 SBC, and retaining the same key technical features and benefits, the U-C8770 is ideal for I/O-intensive data processing military and aerospace applications, including unmanned vehicles, RADAR, SIGINT, electronic warfare and sensor signal processing.
- Rugged 3U VPX Single-Slot SBC
- SOSA™ aligned
- Supports I/O Intensive SBC slot profile
- Both PCIe x4 and 40GE data plane options
- PCIe x4 expansion plane
- Intel Xeon-D 1500 series CPU with up 16cores/32 threads
- Up to 64 GB DDR4 w/ECC @ 2133 MT/s
- Up to 1 TB On-Board SATA SSD, with Encryption, Quick Erase, and Secure Erase
- AiSecure™ Cybersecurity Framework
- Xilinx UltraScale+ FPGA w/ARM CPU
- XMC Slot w/PCIe x8 Gen3
- P1w9-X12d+X16s+X8d XMC I/O mapping
- Versatile Board I/O
- USB 3.0 & 2.0
- SATA III
- Serial
- Discrete
- 1GE
- 10GE
- WWDT, ETR, RTC, Temp. Sensors
- IPMI, VITA 46.11 Tier 1 & Tier 2 Support
- Windows®, Linux®, VxWorks® Support
- 2LM Option per VITA 48.2
- Conduction and Air-Cooled Versions
- Vibration and Shock Resistant
U-TM8770
Rear Transition Module (RTM) providing convenient access to U-C8770 I/O interfaces via standard connectors and to all XMC I/O via headers. Supports both air and conduction-cooled U-C8770 when installed in a compatible system.
Related Products
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C877 | 3U VPX SBC
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CM870 | PMC/XMC Carrier Expansion Card
To expand beyond the PMC/XMC sites on 3U VPX SBCs, Aitech has developed the CM870 PMC/XMC Carrier.
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TM660 | Transition Module
Aitech’s TM660 transition module is designed as a supplement to the C660 6U CompactPCI Switch, and intended for use in commercial air-cooled enclosures.