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U-C850x Series | Innovative SWaP-C-optimized Secure 3U SBCs

Intel® 11th Gen Tiger Lake UP3 SoC

Optimized for low SWaP-C and based on the innovative Intel® Tiger Lake UP3 CPU SoC, the U-C850X series combines the three pillars of modern data processing on the same board: CPU, iGPU and optional large FPGA. It also offers AiSecure™ cybersecurity protection coupled with large RAM and storage capacities. The SBCs feature ground-breaking performance per watt and are available with 12W, 15W & 28W TDP options.

The boards integrate both a high-performance CPU with 4 cores/8 threads, an innovative GPU with up to 96 Execution Units, an advanced Image Processing Unit supporting multiple displays with up to 8K resolution and other advanced I/O options into the same System on Chip. The U-C850x series is ideal for harsh military and aerospace applications that need to reliably process significant amounts of data, including unmanned vehicles (UAV/UGV), mission computers, digital signal and image processing, signal intelligence and electronic warfare (EW).


  • Rugged, Cybersecurity-enabled 3U VPX SBCs
  • Aligned with the SOSA™ standard
    • Supports I/O Intensive SBC slot profile
    • Optional additional 10GBaseT Ethernet
  • Intel Tiger Lake UP3 SoC w/up to 4 cores/8 threads, 12/15/28W TDP
    • Strong Integrated GPU w/96 Execution Units
    • Integrated IPU, AVX-512, AI Acceleration
  • Up to 64 GB LPDDR4X w/In-Band ECC @ 4267 MT/s
  • Up to 1TB SATA SSD + 2TB NVMe SSD, with Encryption, Quick Erase and Secure Erase
  • AiSecure™ Cybersecurity Framework
  • High Speed Backplane Connectivity
    • Up to 4x PCIe Gen4 and 4x PCIe Gen3
    • Up to 4x 10GE (Two SERDES and Two Copper)
  • Versatile Board I/O
    • USB 3.2 & 2.0
    • Serial
    • Up to 4x 10GE
    • SATA 3.0
    • GPIO
    • DP/HDMI
  • WWDT, ETR, RTC, Temp. Sensors
  • IPMI, VITA 46.11 Tier 1 & Tier 2 Support
  • Windows®, Linux®, VxWorks® Support
  • 2LM Option per VITA 48.2
  • Conduction and Air-Cooled Versions
  • Vibration and shock Resistant
U-C8500 Block Diagram
U-C8501 Block Diagram
U-C8502 Block Diagram


Rear Transition Module (RTM) providing convenient access to interfaces on all configurations of the U-C850x Series via standard connectors and to all XMC I/O via headers. Supports both air and conduction-cooled models of the U-C850x Series when installed in a compatible system.

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