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U-C850x Series | 3U VPX Cybersecurity-enabled SOSA Aligned SBCs
Intel® 11th Gen Tiger Lake UP3 SoC
The U-C850x Series of 3U VPX Cybersecurity-enabled SOSA Aligned SBCs (U-C8500, U-C8502) features a multi-core Intel Architecture CPU processor, strong GPGPU AI processing and AiSecure™ advanced cybersecurity. Alignment with the SOSA Technical Standard 1.0 allows for much faster, easier integration and upgrades, while improving time-to-market and lowering risk.
The new SBCs use the innovative Intel 11th generation Tiger Lake UP3 (TGL-UP3) SoC that enables ground-breaking performance per Watt, with 12W, 15W & 28W TDP options. The U-C850x series is ideal for harsh military and aerospace applications that need to reliably process significant amounts of data, including unmanned vehicles (UAV/UGV), mission computers, digital signal and image processing, signal intelligence and electronic warfare (EW).
Available in two configurations:
- U-C8500: supports 4x PCIe Gen4 lanes over the Data Plane Download Datasheet
- U-C8502: supports 40 Gbps Data Plane and 4x PCIe Gen4 Expansion Plane; integrated Xilinx MPSoC FPGA Download Datasheet
- Rugged, Cybersecurity-enabled 3U VPX SBCs
- Aligned with the SOSA™ standard
- Supports I/O Intensive SBC slot profile
- Optional additional 10GBaseT Ethernet
- Intel Tiger Lake UP3 SoC w/up to 4 cores/8 threads, 12/15/28W TDP
- Strong Integrated GPU w/96 Execution Units
- Integrated IPU, AVX-512, AI Acceleration
- Up to 32 GB LPDDR4X w/In-Band ECC @ 4267 MT/s
- Up to 1TB SATA SSD + 2TB NVMe SSD, with Encryption, Quick Erase and Secure Erase
- AiSecure™ Cybersecurity Framework
- Two Available Configurations:
- U-C8500: supports 4x PCIe Gen4 Data Plane, XMC Slot w/PCIe x4 Gen3
- U-C8502: supports 40 Gbps Data Plane and 4x PCIe Gen4 Expansion Plane; integrated Xilinx MPSoC FPGA
- Versatile Board I/O
- USB 3.2 & 2.0
- Serial
- Up to 4x 10GE
- SATA 3.0
- GPIO
- DP/HDMI
- WWDT, ETR, RTC, Temp. Sensors
- IPMI, VITA 46.11 Tier 1 & Tier 2 Support
- Windows®, Linux®, VxWorks® Support
- 2LM Option per VITA 48.2
- Conduction and Air-Cooled Versions
- Vibration and shock Resistant
U-TM8500
Rear Transition Module (RTM) providing convenient access to interfaces on all configurations of the U-C850x Series via standard connectors and to all XMC I/O via headers. Supports both air and conduction-cooled models of the U-C850x Series when installed in a compatible system.
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