C875 | 3U VPX SBC

Intel®  Xeon®  Processor

Aitech’s C875 is a high-performance 3U VPX SBC for embedded and harsh environment applications.  The heart of the C875 is Intel’s Coffee Lake platform, featuring a 6-Core 8th Generation Intel® Xeon® E-2176M processor with integrated Intel® UHD Graphics 630, coupled with a companion Intel® CM246 Chipset I/O Platform Controller Hub (PCH).

The C875 integrates large on-board RAM (DDR4) and mass storage (Flash disk) resources, and provides a variety of popular I/O interfaces to meet a wide range of system requirements. Expandability and further flexibility are supported by an industry standard XMC slot.

  • Rugged 3U VPX Single-Slot SBC
  • 8th Gen E-2176M Intel® Xeon® CPU
  • 6 Cores/12Threads @ 2.7 GHz
  • Turbo Boost @ 4.4 GHz
  • Intel UHD Graphics 630
  • Up to 32 GB DDR4 w/ECC @ 2133 MT/s
  • Up to 1 TB On-Board SSD
  • Versatile Board I/O
  • USB 3.0 & 2.0
  • Serial
  • HDMI
  • SATA III
  • Discrete
  • RGBHV
  • Audio In/Out
  • GbE
  • XMC Slot w/PCIe x8 Gen3
  • 8 Lane PCIe Gen3 VPX Data Plane
  • Microsemi SmartFusion™ FPGA with
  • ARM CPU
  • Up to 3 Graphics Heads (2x HDMI, RGB)
  • Auto System/Peripheral Configuration
  • Cybersecurity
  • WWDT, ETR, RTC, Temp. Sensors
  • IPMI, VITA 46.11 Tier 1 & Tier 2 Support
  • Windows®, Linux®, VxWorks® Support
  • Open VPX Compliant
  • 2LM Option per VITA 48.2
  • Conduction and Air-Cooled Versions
  • Vibration and Shock Resistant
 

TM875

The TM875 RTM provides convenient access via standard connectors to the C875 I/O interfaces and all PMC/XMC I/O.

CM870

This 3U VPX PMC/XMC carrier provides significantly expanded system functionality by enabling the C875 to control additional PMCs over the VPX backplane.

Learn more about the CM870 carrier card >>

Development Kit

  • Commercial air-cooled enclosure with power supply and fan unit
  • Two 3U VPX slots with 1 x DFP (PCIe x8) connected between slots
  • TM875 transition module

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