SBC and XMC combine with powerful software bundles to deliver high performance in rugged, size-optimized package
Technical Specifications
- Integrated SBC, XMC and software offers high performance video processing
- C912 SBC with NXP T4 series SoC; M596 XMC with AMD’s Radeon E8860 GPU
- Versatile I/O for standard or custom configurations
- Extensive on-board memory resources
Chatsworth, Calif. August 2017 – Aitech’s latest innovation, the CB912 VideoPaC, combines two powerful processing boards and advanced software bundles into an integrated platform that provides exceptional graphics computing in a single-slot, SWaP-optimized, rugged package.
The new PowerPC-based VideoPaC pairs a 3U VPX single-slot SBC (single board computer) with a video/graphics XMC mezzanine that features the AMD E8860 Radeon GPU. This combination adds new dimensions to embedded data and graphics processing, such as offering an optional video imaging FPGA, which provides video input interfaces and additional output interfaces not natively supported by the GPU.
To fully capitalize on the powerful processing of the hardware, integrated software bundles provide users with real-world solutions for their mission- and flight safety-critical, DO178 Level A imaging, high-end graphics and data processing applications.
Emil Kheyfets, director of military & aerospace product management at Aitech Defense Systems, Inc., noted, “Embedded computing is not just about data processing, although that’s a critical task. As we see deep learning emerging from the use of GPUs, Aitech is developing hardware to keep pace with the growing analysis of complex data, while investing in the software resources that will move it all forward.”
Software bundles include Wind River VxWorks and VxWorks A653, and GreenHills INTEGRITY and INTEGRITY-178 with tuMP (True Multi-Processing), coupled with CoreAVI’s FACE-compliant, OpenGL SC (Safety Critical) or Richland Technologies VIPUR/RTGL certifiable graphics/video software drivers.
Maximum Performance with Robust Resources
The qualified, fully-integrated and tested VideoPaC provides an improved heat dissipation solution for graphics-intensive display computing in harsh environments. Specific uses include glass cockpit displays and mission computers as well as situational awareness, C4ISR and EW systems.
In addition to the NXP T4-series with 4, 8 or 12 cores SoC with AltiVec on the SBC and the XMC’s AMD’s Radeon E8860 GPU, the CB912 VideoPaC offers many other features including both windowed and standard watchdog timers, a CyberSecure Boot and Trust Architecture, Intelligent Platform Management Interface (IPMI) and a real-time clock. VPX backplane interfaces include PCIe and XAUI fabric options. An elapsed time recorder, temperature sensors and eight counters/timers and two-level maintenance support round out the board assembly’s internal resources.
Exceptional Memory; Versatile I/O
The CB912 provides up to 4 GB of DDR3L SDRAM with ECC and operates at 1600 MT/s, configured in dual channels. An optional 16 GB SATA Flash Disk, using SLC (single-level cell) Flash memory is available. Boot Flash of 128 MB NOR Flash is broken out into 64 MB for Boot and 64 MB available to user. The 512 kB high speed MRAM offers unlimited writes and long-term data retention.
The CB912 VideoPaC comes in two standard external I/O arrangements with user-specific configurations available upon request. The versatile I/O includes combinations of USB, Serial, GbE, discrete and SATA interfaces as well as composite, S-video and STANAG 3350. Additional outputs include DVI/HDMI and RGBHV, while SDI (SD/HD) is also available as video inputs.
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